The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 1991

Filed:

Oct. 09, 1990
Applicant:
Inventors:

Hiroyuki Hiramitsu, Handa, JP;

Tomoyuki Maebashi, Handa, JP;

Takaharu Iwadachi, Handa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C21D / ;
U.S. Cl.
CPC ...
148 / ; 148-2 ;
Abstract

A beryllium copper alloy member is provided having both a high electrical conductivity of not less than 70% IACS and a high strength of not less than 70 kgf/mm.sup.2 by an extensively simplified production method which widely decreases the production cost of the alloy member. The method includes, shaping a cast ingot alloy consisting in weight basis of 0.15-0.6% of Be, 0.6-3.0% of Ni, and the test of Cu and unavoidable impurities to a desired shape by working it to destroy the cast organization structure of the alloy, heat annealing the shaped alloy at a condition of 400.degree.-650.degree. C..times.1-100 hrs, and cold working the heat annealed alloy to a final shape by a working rate of at least 80%.


Find Patent Forward Citations

Hiramitsu, Hiroyuki. (1991). Method of producing beryllium copper alloy member (U.S. Patent No. 5074922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5074922

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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