The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Mar. 22, 2000
Applicant:
Inventor:
Takaharu Iwadachi, Handa, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 2/018 ; B23K 2/000 ;
U.S. Cl.
CPC ...
B23K 2/018 ; B23K 2/000 ;
Abstract
A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum alloy is then formed on the diffusion inhibiting layer. During the HIP bonding step, an insert composed of an aluminum-magnesium alloy is juxtaposed between the outer aluminum layer of the pre-treated copper alloy member and the beryllium member.