The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2000
Filed:
Feb. 02, 1999
Takaharu Iwadachi, Handa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A HIP-bonded body of a beryllium member and a copper alloy member. The beryllium member comprises on its one side a thin layer of titanium, chromium, molybdenum or silicon as a diffusion inhibition layer. The beryllium member is HIP-bonded to the copper alloy member, with the diffusion inhibition layer situated between the two members. A layer of pure copper or pure nickel may be formed on the diffusion inhibition layer, as a bonding promotion layer. An aluminum layer may be formed on the surface of the beryllium member, as a stress relaxation layer on which the diffusion inhibition layer is formed. The bonded body has excellent bonding strength and thermal cycle resistance property, and can be obtained in economical manner.