The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Oct. 01, 1998
Applicant:
Inventor:
Takaharu Iwadachi, Handa, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 2/000 ; B23K 2/800 ; B23K 1/506 ; B23K 3/102 ; B23K 3/538 ;
U.S. Cl.
CPC ...
B23K 2/000 ; B23K 2/800 ; B23K 1/506 ; B23K 3/102 ; B23K 3/538 ;
Abstract
According to the present invention, an insert material is laid between metal beryllium and copper alloy, wherein the insert material has the minimum, solidus temperature of not lower than 870° C. to the metal beryllium and copper alloy, respectively, and a single diffusion bonding process is performed under the condition that the temperature is not lower than 850° C. and less than the minimum solidus temperature, and the pressure is 20 to 30O MPa, so that the metal beryllium, copper alloy and stainless steel can be effectively bonded without deterioration of corrosion resistance for sensitizing of the stainless steel.