San Jose, CA, United States of America

Taegui Kim

USPTO Granted Patents = 4 

Average Co-Inventor Count = 4.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):Explore Patents

Title: Taegui Kim: Innovator in Semiconductor Packaging

Introduction

Taegui Kim is a prominent inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His innovative work focuses on enhancing the efficiency and functionality of system-on-chip (SoC) package substrates.

Latest Patents

One of Taegui Kim's latest patents is titled "Asymmetric Stackup Structure for SoC package substrates." This invention discloses an asymmetric stackup structure that includes a substrate with one or more insulating material layers. A first recess is formed in the upper surface of the substrate, reaching down to a conductive layer. An integrated passive device is positioned within this recess, and multiple build-up layers are formed on top of the substrate. Additionally, at least one via path connects contacts on the lower surface of the substrate to those on the upper surface of the build-up layers.

Another notable patent is "Semiconductor packaging substrate fine pitch metal bump and reinforcement structures." This patent describes semiconductor packaging substrates and processing sequences. In this embodiment, a packaging substrate features a build-up structure and a patterned metal contact layer that is partially embedded within the build-up structure. The patterned metal contact layer includes an array of surface mount (SMT) metal bumps in a chip mount area, along with a metal dam structure or a combination thereof.

Career Highlights

Taegui Kim is currently employed at Apple Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance of electronic devices.

Collaborations

Throughout his career, Taegui has collaborated with talented individuals such as Yifan Kao and Jun Chung Hsu. These collaborations have fostered innovation and contributed to the success of various projects within the semiconductor industry.

Conclusion

Taegui Kim is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in technology. His patents reflect a commitment to innovation and excellence in the field.

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