The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 04, 2023
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Yikang Deng, Cupertino, CA (US);

Yifan Kao, Taoyuan, TW;

Jun Chung Hsu, Cupertino, CA (US);

Taegui Kim, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/63 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 70/635 (2026.01); H10W 90/722 (2026.01);
Abstract

Routing substrates, methods of manufacture, and electronic assemblies including routing substrates are described. In an embodiment, a routing substrate includes a plurality of metal routing layers, a plurality of dielectric layers including a top dielectric layer forming a topmost surface, and a cavity formed in the topmost surface. The cavity may include a bottom cavity surface, a first plurality of first surface mount (SMT) metal bumps embedded within the top dielectric layer and protruding from the topmost surface of the top dielectric layer, and a second plurality of second SMT metal bumps embedded within an intermediate dielectric layer of the plurality of dielectric layers and protruding from the bottom cavity surface.


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