Yifan Kao

Title: Yifan Kao: Innovator in Semiconductor Packaging

Introduction

Yifan Kao is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His innovative work focuses on enhancing the efficiency and functionality of system-on-chip (SoC) package substrates.

Latest Patents

Yifan Kao's latest patents include an "Asymmetric Stackup Structure for SoC package substrates." This invention discloses a unique asymmetric stackup structure that incorporates one or more insulating material layers. A first recess is formed in the upper surface of the substrate, reaching down to a conductive layer. An integrated passive device is positioned within this recess, while multiple build-up layers are formed on top of the substrate. Additionally, at least one via path connects contacts on the lower surface of the substrate to those on the upper surface of the build-up layers.

Another notable patent is the "Semiconductor packaging substrate fine pitch metal bump and reinforcement structures." This patent describes semiconductor packaging substrates and their processing sequences. In this embodiment, the packaging substrate features a build-up structure with a patterned metal contact layer that is partially embedded and protrudes from the build-up structure. The patterned metal contact layer includes an array of surface mount (SMT) metal bumps in a chip mount area, along with a metal dam structure or a combination thereof.

Career Highlights

Yifan Kao is currently employed at Apple Inc., where he continues to push the boundaries of semiconductor technology. His work is instrumental in developing advanced packaging solutions that meet the demands of modern electronic devices.

Collaborations

Yifan has collaborated with notable colleagues, including Taegui Kim and Jun Chung Hsu. Their combined expertise contributes to the innovative projects they undertake in the semiconductor field.

Conclusion

Yifan Kao is a key figure in semiconductor packaging innovation, with a focus on enhancing SoC package substrates. His patents reflect a commitment to advancing technology in this critical area. His contributions will undoubtedly influence the future of electronic device design and functionality.