Tae Je Cho

Title: The Innovative Contributions of Tae Je Cho

Introduction

Tae Je Cho is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on advanced packaging solutions that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents, Tae Je Cho has developed a fan-out semiconductor package. This innovative package includes a semiconductor chip with an active surface featuring connection pads, and an inactive surface that is covered by an encapsulant. A thermally conductive via penetrates through the encapsulant, ensuring effective heat dissipation. Additionally, a connection structure on the active surface includes a redistribution layer that is electrically connected to the connection pads.

Another notable patent is for a substrate having an embedded interconnect structure. This substrate features an interconnect structure that includes circuit layers and a passive device with an external electrode. The printed circuit board is designed with an insulating layer that covers the interconnect structure, along with wiring layers and vias that facilitate electrical connections between the components.

Career Highlights

Tae Je Cho has worked with leading companies in the technology sector, including Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd. His experience in these organizations has allowed him to contribute to cutting-edge advancements in semiconductor technology.

Collaborations

Throughout his career, Tae Je Cho has collaborated with notable colleagues such as Kwan Jai Lee and Young Jae Song. These partnerships have fostered innovation and have led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Tae Je Cho's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic devices and packaging solutions.