The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Oct. 21, 2016
Byoung Soo Kwak, Seoul, KR;
Tae Hong Min, Hwaseong-si, KR;
IN Young Lee, Yongin-si, KR;
Tae Je Cho, Yongin-si, KR;
Byoung Soo Kwak, Seoul, KR;
Tae Hong Min, Hwaseong-si, KR;
In Young Lee, Yongin-si, KR;
Tae Je Cho, Yongin-si, KR;
Abstract
There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes a first semiconductor chip including a first surface and a second surface opposite to each other, a flow regulating structure formed at the first surface of the first semiconductor chip, and a second semiconductor chip mounted on the first surface of the first semiconductor chip. The second semiconductor chip overlaps at least a portion of the flow regulating structure.