The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Mar. 23, 2000
Ju Hyun Lyu, Asan, KR;
Kwan Jai Lee, Cheonan, KR;
Tae Je Cho, Suwon, JP;
Samsung Electronics Co., Ltd., Kyungki-Do, KR;
Abstract
A stacked package formed by stacking semiconductor device packages and a method of manufacturing a stacked semiconductor package. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads at a surface of the package body. Each of the packages is stacked on another package by electrically connecting the exposed surfaces of the leads. The manufacturing method includes preparing lead frames, including a plurality of leads, supporting a semiconductor chip in a chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals of the leads, forming a package body of a thickness such that a portion of surface of the leads are exposed, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.