The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1999
Filed:
Aug. 21, 1997
Young Jae Song, Seongnam, KR;
Se Yong Oh, Seoul, KR;
Tae Je Cho, Yongin, KR;
Seung Ho Ahn, Suwon, KR;
Min Ho Lee, Yongin, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.