Substrate having embedded interconnect structure

Abstract

A substrate having an embedded interconnect structure includes an interconnect structure including a circuit member including circuit layers and a passive device disposed in parallel with the circuit member and including an external electrode, and a printed circuit board including an insulating layer covering the interconnect structure, a first wiring layer disposed on the insulating layer, a first wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to an uppermost circuit layer, among the circuit layers, and a second wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the first wiring via, is coplanar with a top surface of the external electrode, contacting the second wiring via.