Tae Hong Kim

USPTO Granted Patents = 19 (Patent Applications = 2)

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 57(Granted Patents)

Location History:

Round Rock, TX (US) (2012 - 2016)
Austin, TX (US) (2012 - 2017)
Chandler, AZ (US) (2013 - 2021)

Company Filing History:

16 out of 164,108

International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

patents

Years Active: 2012-2021

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10910150 - Reconfigurable coupled inductor (2021-02-02),

2. 9853546 - Method and apparatus for reducing overshoot and undershoot using a reconfigurable inductor for switching mode voltage (2017-12-26),

3. 9773725 - Coreless multi-layer circuit substrate with minimized pad capacitance (2017-09-26),

4. 9277653 - Through-hole-vias in multi-layer printed circuit boards (2016-03-01),

5. 8975525 - Corles multi-layer circuit substrate with minimized pad capacitance (2015-03-10),

6. 8830690 - Minimizing plating stub reflections in a chip package using capacitance (2014-09-09),

7. 8785289 - Integrated decoupling capacitor employing conductive through-substrate vias (2014-07-22),

8. 8766107 - Through-hole-vias in multi-layer printed circuit boards (2014-07-01),

9. 8658911 - Through-hole-vias in multi-layer printed circuit boards (2014-02-25),

10. 8631706 - Noise suppressor for semiconductor packages (2014-01-21),

11. 8569873 - Mitigation of plating stub resonance by controlling surface roughness (2013-10-29),

12. 8558345 - Integrated decoupling capacitor employing conductive through-substrate vias (2013-10-15),

13. 8495537 - Timing analysis of an array circuit cross section (2013-07-23),

14. 8488329 - Power and ground vias for power distribution systems (2013-07-16),

15. 8389870 - Coreless multi-layer circuit substrate with minimized pad capacitance (2013-03-05),

Title: **The Innovative Contributions of Tae Hong Kim in Electrical Engineering**

Introduction

Tae Hong Kim is a prominent inventor based in Austin, TX, known for his contributions to the field of electrical engineering. With a remarkable portfolio consisting of 19 patents, Kim has made significant advancements, particularly in the area of reconfigurable inductors and switching voltage regulators.

Latest Patents

Among his latest inventions, Tae Hong Kim has developed a reconfigurable coupled inductor that enhances the control of inductor properties, such as the coupling coefficient. This innovation utilizes metal rings and switches that manipulate the inductor’s characteristics based on their operational state. Another noteworthy patent addresses the reduction of overshoot and undershoot in switching voltage regulators. This invention employs a reconfigurable inductor with a conductive control ring, enabling finer control over its inductance, thus improving the efficiency of voltage regulation systems.

Career Highlights

Throughout his career, Tae Hong Kim has been associated with leading technology companies, including International Business Machines Corporation (IBM) and Intel Corporation. His experience at these organizations has allowed him to develop expertise and collaborate on innovations that push the boundaries of electrical engineering.

Collaborations

Kim has worked alongside talented colleagues such as Moises Cases and Rohan U Mandrekar, indicating a collaborative approach to innovation that merges diverse ideas and expertise. These collaborations have further enhanced the breadth and impact of his inventions.

Conclusion

Tae Hong Kim's work signifies a blend of creativity and scientific rigor in electrical engineering. His dedication to innovation is evident in his numerous patents and collaborations, paving the way for future advancements in technology. As he continues to develop groundbreaking solutions, Kim remains a key figure in the evolution of electrical systems.

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