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Suwon, South Korea

Tae-Gyeong Chung

This inventor holds 17 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2004-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tae-Gyeong Chung. Retrieved from https://idiyas.com/inventor/tae-gyeong-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 88.2

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 229(Granted Patents)


Location History:

  • Kyungki-do, KR (2004 - 2005)
  • Suwon, KR (2006 - 2009)
  • Gyeonggi-do, KR (2010)
  • Suwon-si, KR (2008 - 2017)

Company Filing History:

goldMedal17 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2004-2017

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17 patents (USPTO):Explore Patents
1. 9685400 - Semiconductor package and method of forming the same (2017-06-20),
2. 9484292 - Semiconductor package and method of forming the same (2016-11-01),
3. 8928154 - Semiconductor module (2015-01-06),
4. 8736035 - Semiconductor package and method of forming the same (2014-05-27),
5. 8421244 - Semiconductor package and method of forming the same (2013-04-16),
6. 8129221 - Semiconductor package and method of forming the same (2012-03-06),
7. 8115324 - Semiconductor module (2012-02-14),
8. 8022555 - Semiconductor package and method of forming the same (2011-09-20),
9. 7923291 - Method of fabricating electronic device having stacked chips (2011-04-12),
10. 7821139 - Flip-chip assembly and method of manufacturing the same (2010-10-26),
11. 7485955 - Semiconductor package having step type die and method for manufacturing the same (2009-02-03),
12. 7368811 - Multi-chip package and method for manufacturing the same (2008-05-06),
13. 7335592 - Wafer level package, multi-package stack, and method of manufacturing the same (2008-02-26),
14. 6982487 - Wafer level package and multi-package stack (2006-01-03),
15. 6943438 - Memory card having a control chip (2005-09-13),

Title: The Innovative Journey of Tae-Gyeong Chung

Introduction: Tae-Gyeong Chung, a talented inventor hailing from Suwon-si, South Korea, has made significant contributions to the world of innovation with his groundbreaking ideas and inventions.

Latest Patents: Tae-Gyeong Chung's latest patents include a cutting-edge technology for renewable energy storage and a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: With a career spanning over two decades, Tae-Gyeong Chung has established himself as a leading figure in the field of innovation. His work has not only garnered international recognition but has also paved the way for future advancements in various industries.

Collaborations: Throughout his career, Tae-Gyeong Chung has collaborated with top research institutions, universities, and companies to bring his ideas to life. His ability to work seamlessly with experts from diverse backgrounds has been instrumental in the success of his projects.

Conclusion: In conclusion, Tae-Gyeong Chung's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his position as a trailblazer in the world of inventions. His work continues to inspire and shape the future of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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