Kyunggi-do, South Korea

Sung Hwan Cho

USPTO Granted Patents = 4 

Average Co-Inventor Count = 7.7

ph-index = 1


Location History:

  • Jecheon Si, KR (2015)
  • Kyunggi-do, KR (2020 - 2024)

Company Filing History:


Years Active: 2015-2025

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Sung Hwan Cho in Semiconductor Technology

Introduction

Sung Hwan Cho is a prominent inventor based in Kyunggi-do, South Korea, known for his contributions to the field of semiconductor technology. With a total of three patents to his name, he has made significant advancements that are beneficial to various electronic applications.

Latest Patents

Cho's latest innovation revolves around a "Semiconductor device with through-mold via." This invention presents multiple embodiments of a semiconductor device, which includes a substrate with a conductive pattern formed on it. Essential to the device is at least one semiconductor die that is electrically connected to the substrate, with both components at least partially covered by a package body. Notably, the invention incorporates through-mold vias in the package body, allowing for electrical signal paths extending from exterior surfaces to the conductive patterns on the substrate. Additionally, these vias facilitate signals between the semiconductor die and the exterior surface. In some embodiments, interposers may be included, which may or may not be electrically connected to the vias and can either be covered by the package body or placed in proximity.

Career Highlights

Throughout his career, Sung Hwan Cho has worked with leading companies in the semiconductor industry, including Amkor Technology Singapore Holding Pte. Ltd. and the Inha-Industry Partnership Institute. His expertise in semiconductor technology has enabled him to drive forward innovative solutions that enhance electronic performance.

Collaborations

Cho's work often involves collaborations with other skilled professionals in the industry. Notable coworkers include Dong Joo Park and Jin Seong Kim, with whom he has shared knowledge and expertise in semiconductor device development.

Conclusion

Sung Hwan Cho exemplifies the spirit of innovation within the semiconductor field. His patents, especially concerning devices with through-mold vias, represent a significant leap forward in technology, showcasing his dedication to enhancing electronic functionalities. Through collaboration and professionalism, Cho continues to impact the industry positively, setting the stage for future advancements in semiconductor technology.

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