This inventor holds 5 USPTO granted patents. Top assignee: Sumco Corporation. Active years: 2014-2025.
Location History:
- Tokyo, JP (2014 - 2015)
- Minato-ku, JP (2017)
- Saga, JP (2017)
Company Filing History:
Years Active: 2014-2025
Title: The Innovations of Sumihisa Masuda
Introduction
Sumihisa Masuda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing of silicon wafers. With a total of 5 patents to his name, Masuda's work has been instrumental in advancing wafer separation techniques.
Latest Patents
Masuda's latest patents include a wafer separation apparatus and method, as well as a method for manufacturing silicon wafers. The wafer separation apparatus is designed to prevent poor wafer separation by incorporating an injection port for fluid, a rolling element, and a holder that allows for reciprocal movement. This innovative design enhances the efficiency of wafer separation processes. Additionally, his method for producing epitaxial wafers focuses on achieving a highly flat rear surface without the need for polishing after the epitaxial film is formed. This method involves preparing a semiconductor wafer with a beveled portion and processing the outer peripheral region to create a roll-off area, ultimately leading to improved wafer quality.
Career Highlights
Masuda has built a successful career at Sumco Corporation, a leading company in the semiconductor industry. His expertise in wafer technology has positioned him as a key figure in the development of advanced manufacturing techniques.
Collaborations
Throughout his career, Masuda has collaborated with notable colleagues such as Kazuhiro Narahara and Tomohiro Hashii. These partnerships have fostered innovation and contributed to the success of various projects within the semiconductor field.
Conclusion
Sumihisa Masuda's contributions to semiconductor technology through his patents and innovative methods have significantly impacted the industry. His work continues to pave the way for advancements in wafer manufacturing and separation techniques.