The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Dec. 20, 2023
Applicant:
Sumco Corporation, Tokyo, JP;
Inventors:
Tomohiro Hashii, Tokyo, JP;
Tsukasa Yoshihara, Tokyo, JP;
Yasunori Yoshioka, Tokyo, JP;
Kawahito Shinichi, Tokyo, JP;
Sumihisa Masuda, Tokyo, JP;
Assignee:
SUMCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B32B 43/006 (2013.01); B32B 2457/14 (2013.01); H01L 21/02043 (2013.01); Y10T 156/1174 (2015.01); Y10T 156/1939 (2015.01); Y10T 156/195 (2015.01);
Abstract
It would be helpful to provide a wafer separation apparatus and method, and a method for manufacturing a silicon wafer in which poor wafer separation can be easily prevented. A wafer separation apparatusincludes an injection portconfigured to inject a fluid, a rolling element, and a holderconfigured to movably hold the rolling elementin a rollable and integral manner, to be reciprocatable and biased to one side in a reciprocating direction, and to be integrally connected to the injection port