Stephen Joseph Fuerniss

This inventor holds 17 USPTO granted patents, primarily in Dielectric Structures. Top assignees: International Business Machines Corporation, International Business Corporation. Active years: 1989-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stephen Joseph Fuerniss. Retrieved from https://idiyas.com/inventor/stephen-joseph-fuerniss

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 17

% Patents Active = 82.4

Average Co-Inventor Count = 5.5

ph-index = 8

Forward Citations = 222(Granted Patents)

Location History:

Endicott, NY (US) (1989 - 2000)
late of Endicott, NY (US) (2002 - 2004)

Company Filing History:

16 out of 166,425

International Business Machines Corporation

patents

1 out of 71

International Business Corporation

patents

Years Active: 1989-2004

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Areas of Expertise:

Photoimageable Dielectric

Polymer Adhesion

Thin Flexible Interposer

Gray Scale Etching

Component Carrier

Solder Joint Encapsulation

Curved Substrate Planarization

Toughened Photosensitive Resist

Printed Wiring Boards

Polymide Pattern

Lead Protective Coating

Bonding Sites

17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6830875 - Forming a through hole in a photoimageable dielectric structure (2004-12-14),

2. 6790473 - Lead protective coating composition, process and structure thereof (2004-09-14),

3. 6730409 - Promoting adhesion between a polymer and a metallic substrate (2004-05-04),

4. 6699350 - Dielectric structure and method of formation (2004-03-02),

5. 6521844 - Through hole in a photoimageable dielectric structure with wired and uncured dielectric (2003-02-18),

6. 6495239 - Dielectric structure and method of formation (2002-12-17),

7. 6485892 - Method for masking a hole in a substrate during plating (2002-11-26),

8. 6156484 - Gray scale etching for thin flexible interposer (2000-12-05),

9. 6150726 - Component carrier with raised bonding sites (2000-11-21),

10. 6150255 - Method of planarizing a curved substrate and resulting structure (2000-11-21),

11. 6129955 - Encapsulating a solder joint with a photo cured epoxy resin or cyanate (2000-10-10),

12. 6015520 - Method for filling holes in printed wiring boards (2000-01-18),

13. 5940729 - Method of planarizing a curved substrate and resulting structure (1999-08-17),

14. 5919596 - Toughened photosensitive polycyanurate resist, and structure made (1999-07-06),

15. 5872337 - Chip carrier and cable assembly reinforced at edges (1999-02-16),

Title: The Inventor Stephen Joseph Fuerniss

Introduction: Stephen Joseph Fuerniss is a renowned inventor based in Endicott, NY (US) known for his groundbreaking contributions to various industries.

Latest Patents: Stephen Fuerniss holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovations.

Career Highlights: With a career spanning over two decades, Stephen Fuerniss has established himself as a prolific inventor with a keen eye for identifying gaps in the market and developing unique solutions.

Collaborations: Throughout his career, Stephen Fuerniss has collaborated with leading companies, research institutions, and universities to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Stephen Joseph Fuerniss continues to push the boundaries of innovation, leaving a lasting impact on the world of inventions with his creative and forward-thinking approach.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]