Company Filing History:
Years Active: 2006-2012
Title: Innovations by Soon-Shin Chee
Introduction
Soon-Shin Chee is a prominent inventor based in Sunnyvale, CA, known for his contributions to semiconductor technology. He holds a total of 7 patents, showcasing his expertise and innovative spirit in the field.
Latest Patents
Among his latest patents is a semiconductor device package and methods of manufacturing the same. This invention describes a semiconductor device that includes an integrated circuit (IC) die with a ring of die pads around its periphery, lands disposed within the ring, and bond terminals coupled to the lands. The bond terminals are wire-bonded to respective die pads, and at least one capacitor is mounted to the lands. Another significant patent is for a packaged integrated circuit, which includes an integrated circuit and a package substrate. This invention features a trace in the package substrate that has a first portion and a second, high-inductance portion. The high-inductance portion is positioned near a port of the integrated circuit, providing a selected inductance that works in cooperation with the capacitance of the port to reduce return loss.
Career Highlights
Soon-Shin Chee is currently employed at Xilinx, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has significantly impacted the industry, particularly in enhancing the performance and efficiency of integrated circuits.
Collaborations
He has collaborated with notable colleagues, including Paul Ying-Fung Wu and Steven H C Hsieh, contributing to various projects and advancements in their field.
Conclusion
Soon-Shin Chee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of integrated circuit design and manufacturing.