The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Mar. 28, 2011
Applicants:
Soon-shin Chee, Sunnyvale, CA (US);
Paul Y. Wu, Saratoga, CA (US);
Inventors:
Soon-Shin Chee, Sunnyvale, CA (US);
Paul Y. Wu, Saratoga, CA (US);
Assignee:
Xilinx, Inc., San Jose, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device package and methods of manufacturing the same are described. In some examples, a semiconductor device includes an IC die including a ring of die pads around a periphery thereof, lands disposed within the ring of die pads, bond terminals coupled to the lands, the bond terminals being wire-bonded to respective ones of the die pads, and at least one capacitor having respective terminals mounted to respective ones of the lands.