The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Jan. 29, 2004
Soon-shin Chee, Sunnyvale, CA (US);
Alelie Funcell, Milpitas, CA (US);
Abhay Maheshwari, San Jose, CA (US);
Soon-Shin Chee, Sunnyvale, CA (US);
Alelie Funcell, Milpitas, CA (US);
Abhay Maheshwari, San Jose, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
A method of producing a carrier wafer for an integrated circuit is disclosed. The method comprises the steps of providing a carrier wafer having a plurality of bump pads and a plurality of wire bond pads; providing a passivation layer on the carrier wafer; etching a passivation layer over at least a portion of the plurality of bump pads; applying solder bumps on the plurality of bump pads; and separately etching the passivation layer over at least a portion of the plurality of wire bond pads. An integrated circuit employing a flip chip is also disclosed.