Newark, CA, United States of America

Songyuan Xie


Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 140(Granted Patents)


Location History:

  • Newark, CA (US) (2002 - 2014)
  • Palo Alto, CA (US) (2019)
  • E. Palo Alto, CA (US) (2020)

Company Filing History:


Years Active: 2002-2020

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12 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Songyuan Xie

Introduction

Songyuan Xie is a prominent inventor based in Newark, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on developing methods to enhance the reliability and efficiency of semiconductor substrates.

Latest Patents

Among his latest patents, Xie has developed innovative solutions such as thermally removable fill materials for anti-stiction applications. This method prevents the collapse of patterned, high aspect ratio features formed in semiconductor substrates during the cleaning process. By utilizing a displacement solution that includes a polyalkene carbonate (PAC) and/or a saccharide, he has created a process that allows for the effective removal of fill materials through thermal degradation, thus mitigating silicon loss. Another notable patent involves a method for preventing the collapse of features by using a combination of phenol-formaldehyde polymer and PAC as fill materials, which can be removed via a high etch rate plasma etch process.

Career Highlights

Xie is currently employed at Honeywell International Inc., where he continues to push the boundaries of semiconductor technology. His innovative approaches have garnered attention in the industry, contributing to advancements in manufacturing processes.

Collaborations

Throughout his career, Xie has collaborated with notable colleagues such as Roger Leung and Nigel P Hacker. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge technologies.

Conclusion

Songyuan Xie's contributions to semiconductor technology through his innovative patents and collaborative efforts have made a significant impact in the field. His work continues to pave the way for advancements that improve the efficiency and reliability of semiconductor manufacturing processes.

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