The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

May. 31, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Desaraju Varaprasad, Dublin, CA (US);

Ronald R. Katsanes, Newark, CA (US);

Songyuan Xie, Palo Alto, CA (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/05 (2006.01); C08K 5/06 (2006.01); C08K 5/07 (2006.01); C08K 5/10 (2006.01); C09D 7/20 (2018.01); C09D 183/04 (2006.01); C09D 201/02 (2006.01); H01L 21/02 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C09D 7/20 (2018.01); C09D 201/02 (2013.01); H01L 21/02123 (2013.01); H01L 21/02126 (2013.01); H01L 21/02216 (2013.01); H01L 21/02282 (2013.01); C08K 5/05 (2013.01); C08K 5/06 (2013.01); C08K 5/07 (2013.01); C08K 5/10 (2013.01);
Abstract

A composition is provided including a resin including one or more silicon-based materials, one or more organic-based materials, or a combination of silicon-based materials and organic-based materials. The composition further includes a first solvent having a boiling point from 140° C. to 250° C. and a second solvent having a boiling point from 50° C. to 110° C., wherein the a weight ratio of the first solvent to the second solvent is from 1:1 to 1:5. Methods for applying coatings to substrates are also provided.


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