IDiyas

For the Inventor, By the Inventor

Hwaseong-si, South Korea

So-Young Lim

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 34(Granted Patents)


Company Filing History:

goldMedal9 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2013-2018

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9 patents (USPTO):Explore Patents
1. 9869717 - Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same (2018-01-16),
2. 9437526 - Chip on film package including distributed via plugs (2016-09-06),
3. 9280182 - Chip on film package and display device including the same (2016-03-08),
4. 9059162 - Chip on film (COF) substrate, COF package and display device including the same (2015-06-16),
5. 9059067 - Semiconductor device with interposer and method manufacturing same (2015-06-16),
6. 8581373 - Tape package (2013-11-12),
7. 8502084 - Semiconductor package including power ball matrix and power ring having improved power integrity (2013-08-06),
8. 8436462 - Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure (2013-05-07),
9. 8384407 - Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same (2013-02-26),

Title: So-Young Lim: Innovator of Semiconductor Technology

Introduction

So-Young Lim is a prominent inventor based in Hwaseong-si, South Korea, known for her significant contributions to semiconductor technology. With a remarkable portfolio that includes nine patents, Lim's innovations are paving the way for advancements in the field.

Latest Patents

So-Young Lim's latest patents showcase her expertise in semiconductor inspection and packaging. One of her notable inventions is a test pad structure designed for semiconductor chip inspection. This innovative test pad structure comprises multiple test pads and connection leads, strategically arranged to optimize inspection processes. The design features two groups of test pads, ensuring comprehensive test coverage.

Another notable invention is a chip on film (COF) package that integrates a film substrate with leads of varying lengths. This COF package utilizes via plugs for efficient electrical connections, allowing for a compact and effective means of managing interconnections in semiconductor components.

Career Highlights

Currently, So-Young Lim is employed at Samsung Electronics Co., Ltd., one of the leading technology companies in the world. Throughout her career, she has built a reputation for her innovative approaches and technical expertise. Lim's work not only enhances product functionality but also contributes significantly to the advancement of semiconductor technology.

Collaborations

So-Young Lim collaborates with talented peers, including coworkers Pa-Lan Lee and Jeong-Kyu Ha, with whom she shares insights and expertise. These collaborations foster a dynamic environment that encourages innovative thinking and problem-solving within the field of semiconductor research and development.

Conclusion

So-Young Lim stands out as an influential inventor in the semiconductor sector, with a track record of innovative patents and contributions to her field. Her work at Samsung Electronics Co., Ltd. and her collaboration with industry peers continues to shape the future of semiconductor technology, making her a key figure in the landscape of modern inventions.

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