The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Mar. 25, 2011
Dong-han Kim, Osan-si, KR;
Sung-woo Park, Anyang-si, KR;
Jin-woo Park, Seoul, KR;
So-young Lim, Hwaseong-si, KR;
Jung-hwan Kim, Bucheon-si, KR;
Kwang-jin Bae, Suwon-si, KR;
Pa-lan Lee, Yongin-si, KR;
Dong-Han Kim, Osan-si, KR;
Sung-Woo Park, Anyang-si, KR;
Jin-Woo Park, Seoul, KR;
So-Young Lim, Hwaseong-si, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Kwang-Jin Bae, Suwon-si, KR;
Pa-Lan Lee, Yongin-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.