The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Apr. 23, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
So-Young Lim, Hwaseong-si, KR;
Na-Rae Shin, Yongin-si, KR;
Jeong-Kyu Ha, Hwaseong-si, KR;
Kyoung-Suk Yang, Yongin-si, KR;
Pa-Lan Lee, Daegu, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Abstract
A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs.