Simon McElrea

Title: Simon McElrea: Innovator in Microelectronic Packaging

Introduction

Simon McElrea is a notable inventor based in Scotts Valley, California. He has made significant contributions to the field of microelectronics, particularly in the area of stacked die assemblies. With a total of three patents to his name, McElrea's work focuses on improving electrical interconnections and enhancing the reliability of microelectronic packages.

Latest Patents

McElrea's latest patents include innovative methods for improving electrical interconnection in stacked die assemblies. One of his patents, titled "Stacked die assembly having reduced stress electrical interconnects," discloses methods that enhance the structural features of these assemblies, resulting in reduced electrical interconnect failure. Another patent, "Through interposer wire bond using low CTE interposer with coarse slot apertures," describes a microelectronic package that includes a subassembly and a second substrate. This package is designed with specific thermal expansion properties and features that facilitate efficient electrical connections.

Career Highlights

Simon McElrea is currently employed at Adeia Semiconductor Bonding Technologies Inc. His work at this company has allowed him to push the boundaries of microelectronic packaging technology. His innovative approaches have garnered attention in the industry, showcasing his expertise and commitment to advancing the field.

Collaborations

Throughout his career, McElrea has collaborated with talented individuals such as Belgacem Haba and Wael Zohni. These collaborations have contributed to the development of cutting-edge technologies in microelectronics.

Conclusion

In summary, Simon McElrea is a distinguished inventor whose work in microelectronic packaging has led to significant advancements in the industry. His patents reflect a deep understanding of electrical interconnections and their importance in modern technology.