The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Aug. 24, 2011
Simon Mcelrea, San Jose, CA (US);
Wael Zohni, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts arranged so as to have a pitch of 200 microns or less. First and second microelectronic elements are respectively electrically connected to the first and second contacts. Wire bonds may be used to connect the second element contacts with the second contacts. A second substrate may underlie either the first or the second microelectronic elements and be electrically interconnected with the first substrate. The second substrate may have terminals configured for electrical connection to a component external to the microelectronic package. A monolithic encapsulant may contact the first and second microelectronic elements and the first and second substrates.