The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Nov. 09, 2012
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Simon McElrea, Scotts Valley, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/05624 (2013.01); H01L 24/14 (2013.01); H01L 23/295 (2013.01); H01L 2224/83104 (2013.01); H01L 23/3737 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81801 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/81 (2013.01); H01L 2224/81447 (2013.01); H01L 23/552 (2013.01); H01L 2224/16145 (2013.01); H01L 23/498 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/14051 (2013.01); H01L 21/563 (2013.01); H01L 23/3135 (2013.01); H01L 23/3185 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/13082 (2013.01); H01L 24/92 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/131 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/32225 (2013.01); H01L 23/488 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16227 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01);
Abstract

A microelectronic assembly may include a microelectronic element having a surface and a plurality of contacts at the surface; a first element consisting essentially of at least one of semiconductor or dielectric material, the first element having a surface facing the surface of the microelectronic element and a plurality of first element contacts at the surface of the first element; electrically conductive masses each joining a contact of the plurality of contacts of the microelectronic element with a respective first element contact of the plurality of first element contacts; a thermally and electrically conductive material layer between the surface of the microelectronic element and the surface of the first element and adjacent conductive masses of the conductive masses; and an electrically insulating coating electrically insulating the conductive masses and the surfaces of the microelectronic element and the first element from the thermally and electrically conductive material layer.


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