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For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8912661 B1

PDFFull Text
Date of Patent:
Dec. 16, 2014

Filed:

Nov. 04, 2010

Stacked die assembly having reduced stress electrical interconnects

Applicants:

Scott Mcgrath, Scotts Valley, CA (US);

Jeffrey S. Leal, Scotts Valley, CA (US);

Ravi Shenoy, Dublin, CA (US);

Loreto Cantillep, San Jose, CA (US);

Simon Mcelrea, Scotts Valley, CA (US);

Suzette K. Pangrle, Cupertino, CA (US);

Inventors:

Scott McGrath, Scotts Valley, CA (US);

Jeffrey S. Leal, Scotts Valley, CA (US);

Ravi Shenoy, Dublin, CA (US);

Loreto Cantillep, San Jose, CA (US);

Simon McElrea, Scotts Valley, CA (US);

Suzette K. Pangrle, Cupertino, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:

Lerner, David, Littenberg, Krumholz & Mentlik, LLP

Primary Examiner:

Wael Fahmy

Assistant Examiner:

Sarah Salerno

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01013 (2013.01); H01L 23/562 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01033 (2013.01); H01L 24/24 (2013.01); H01L 23/49805 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01006 (2013.01); H01L 24/82 (2013.01); H01L 23/3121 (2013.01); H01L 2224/24051 (2013.01); H01L 24/32 (2013.01); H01L 24/16 (2013.01); H01L 24/06 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24226 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06551 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/73203 (2013.01); H01L 25/0657 (2013.01); H01L 2224/24011 (2013.01);
Abstract

Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure.

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