Company Filing History:
Years Active: 2014
Title: Innovations by Loreto Cantillep in Stacked Die Assembly Technology
Introduction
Loreto Cantillep is an accomplished inventor based in San Jose, California, known for her contributions to the field of semiconductor technology. With three patents to her name, she has made significant advancements in improving the efficiency and reliability of stacked die assemblies.
Latest Patents
Cantillep's latest patents focus on enhancing electrical interconnection in stacked die assemblies. One of her notable inventions is the "Stacked die assembly having reduced stress electrical interconnects." This patent discloses methods for improving electrical interconnections, resulting in stacked die assemblies characterized by reduced electrical interconnect failure. Another significant patent, "Electrically interconnected stacked die assemblies," discusses configurations where successive die in the stack are offset at a die edge, allowing the die to interconnect through electrically conductive traces, some of which are made from an electrically conductive polymer. Moreover, her designs include an electrically insulative conformal coating with openings at die pads that are electrically connected.
Career Highlights
Loreto is part of Adeia Semiconductor Bonding Technologies Inc., a company specializing in semiconductor technology solutions. Her work has been pivotal in advancing the field and has garnered the attention of industry experts.
Collaborations
Throughout her career, Cantillep has collaborated with esteemed colleagues, including Scott P. McGrath and Simon J. S. McElrea. These collaborations have fostered innovative ideas and have contributed to the successful development of her patented technologies.
Conclusion
Loreto Cantillep continues to push the boundaries of semiconductor technology through her inventive spirit and collaborative efforts. Her patents not only enhance the functionality of stacked die assemblies but also contribute to the broader field of electrical engineering, paving the way for future innovations.