Ravi Shenoy

Title: Innovations by Ravi Shenoy in Stacked Die Assembly Technology

Introduction

Ravi Shenoy is an accomplished inventor based in Dublin, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of stacked die assemblies. His innovative work focuses on improving electrical interconnections, which is crucial for the reliability of modern electronic devices.

Latest Patents

Ravi Shenoy holds a patent for a "Stacked die assembly having reduced stress electrical interconnects." This patent discloses methods for enhancing electrical interconnection in stacked die assemblies. The structural features formed by these methods lead to reduced electrical interconnect failure, thereby improving the overall performance and reliability of the assemblies.

Career Highlights

Ravi Shenoy is currently employed at Adeia Semiconductor Bonding Technologies Inc. His work at the company has been instrumental in advancing semiconductor bonding technologies. With a focus on innovation, he continues to push the boundaries of what is possible in the field.

Collaborations

Ravi has collaborated with notable colleagues such as Scott P. McGrath and Jeffrey S. Leal. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further enhancing the quality of their work.

Conclusion

Ravi Shenoy's contributions to the field of semiconductor technology, particularly through his patent on stacked die assemblies, highlight his innovative spirit and dedication to improving electronic reliability. His work continues to influence the industry positively.