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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shu-Wei Li

USPTO Granted Patents = 15 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal15 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2022-2025

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15 patents (USPTO):Explore Patents
1. 12417981 - Semiconductor device including graphene interconnect and method of making the semiconductor device (2025-09-16),
2. 12300599 - Method for forming semiconductor structure (2025-05-13),
3. 12211740 - Interconnect structure and methods of forming the same (2025-01-28),
4. 12068254 - Interconnection structure and methods of forming the same (2024-08-20),
5. 12068253 - Semiconductor structure with two-dimensional conductive structures (2024-08-20),
6. 12062612 - Semiconductor device structure and methods of forming the same (2024-08-13),
7. 12051645 - Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability (2024-07-30),
8. 11948837 - Semiconductor structure having vertical conductive graphene and method for forming the same (2024-04-02),
9. 11682620 - Graded metallic liner for metal interconnect structures and methods for forming the same (2023-06-20),
10. 11682616 - Semiconductor structure and method for forming the same (2023-06-20),
11. 11670595 - Semiconductor device structure and methods of forming the same (2023-06-06),
12. 11652055 - Interconnect structure with hybrid barrier layer (2023-05-16),
13. 11640940 - Methods of forming interconnection structure including conductive graphene layers (2023-05-02),
14. 11605591 - Semiconductor device structure and methods of forming the same (2023-03-14),
15. 11532549 - Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability (2022-12-20),

Title: **Innovator Shu-Wei Li: Pioneering Semiconductor Advancements in Hsinchu, Taiwan**

Introduction

Shu-Wei Li, a prolific inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 14 patents, he stands out as a key figure in advancing innovation in semiconductor structures and interconnects.

Latest Patents

Among his latest inventions is a groundbreaking method for forming semiconductor structures. This method involves creating a hybrid layered structure that comprises at least a 2D material layer and a first 3D material layer. The process entails removing portions of the hybrid structure to develop a plurality of conductive features and establishing an opening between these features. A dielectric material is then utilized to fill the opening, creating a sealed air gap within.

Another notable patent focuses on interconnect structures and methods for their formation. This invention describes a structure that incorporates a first dielectric layer along with one or more first conductive features containing a primary metal. Additionally, the design integrates multiple graphene layers situated on the conductive features, with a second intercalated metal differing from the first metal.

Career Highlights

Shu-Wei Li is currently associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a recognized leader in semiconductor manufacturing. His expertise and inventive capabilities contribute to the company's reputation for excellence in advancing semiconductor technologies.

Collaborations

In his endeavors, Shu-Wei has collaborated with notable colleagues, including Shin-Yi Yang and Ming-Han Lee. Together, they work towards driving innovation and enhancing the performance of semiconductor structures and technologies.

Conclusion

Shu-Wei Li's dedication to innovation in semiconductor technology and his impressive patent portfolio underscore his role as a leading inventor in the industry. His work continues to pave the way for future developments in semiconductor structures, reinforcing Taiwan's position as a hub for technological advancement.

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