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For the Inventor, By the Inventor

Koshi, Japan

Shinichi Shinozuka

This inventor holds 16 USPTO granted patents, primarily in Substrate Processing. Top assignee: Tokyo Electron Limited. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinichi Shinozuka. Retrieved from https://idiyas.com/inventor/shinichi-shinozuka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16

% Patents Active = 68.8

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 45(Granted Patents)


Location History:

  • Kumamoto, JP (2011)
  • Koshi, JP (2008 - 2022)

Company Filing History:

goldMedal16 out of 10,933 
 
Tokyo Electron Limited
 patents

Years Active: 2008-2025

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Areas of Expertise:
Bonding System
Inspection Method
Temperature Control
Heat Processing
Substrate Processing
Defect Inspection
Computer Storage Medium
Substrate Measuring
16 patents (USPTO):Explore Patents
1. 12451374 - Bonding system and inspection method of inspecting combined substrate (2025-10-21),
2. 12381083 - Bonding apparatus and bonding method (2025-08-05),
3. 11348791 - Bonding apparatus and bonding method (2022-05-31),
4. 8698052 - Temperature control method of heat processing plate, computer storage medium, and temperature control apparatus of heat processing plate (2014-04-15),
5. 8253077 - Substrate processing method, computer-readable storage medium and substrate processing system (2012-08-28),
6. 8242417 - Temperature control method of heat processing plate, computer storage medium, and temperature control apparatus of heat processing plate (2012-08-14),
7. 8135487 - Temperature setting method and apparatus for a thermal processing plate (2012-03-13),
8. 8041525 - Substrate measuring method, computer-readable recording medium recording program thereon, and substrate measuring system (2011-10-18),
9. 7985516 - Substrate processing method, computer-readable storage medium and substrate processing system (2011-07-26),
10. 7968825 - Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate (2011-06-28),
11. 7957828 - Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium (2011-06-07),
12. 7897896 - Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate (2011-03-01),
13. 7867674 - Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program (2011-01-11),
14. 7822574 - Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing system (2010-10-26),
15. 7529595 - Method of controlling substrate processing apparatus and substrate processing apparatus (2009-05-05),

Title: The Innovative Contributions of Shinichi Shinozuka

Introduction

Shinichi Shinozuka is a prominent inventor based in Koshi, Japan. He has made significant contributions to the field of bonding systems and inspection methods, holding a total of 16 patents. His work has been instrumental in advancing technology in substrate bonding and inspection processes.

Latest Patents

Shinozuka's latest patents include a bonding system and an inspection method for inspecting combined substrates. This innovative bonding system comprises a bonding device, an inspection device, and a controller. The bonding device is responsible for forming a combined substrate by bonding a first substrate and a second substrate together. The inspection device then inspects the combined substrate, while the controller manages the inspection process. The controller features a measurement controller, a comparison unit, and a re-measurement controller, which work together to ensure accurate inspection results.

Another notable patent is a bonding apparatus and bonding method designed to bond a first substrate and a second substrate. This apparatus includes a first holder for the first substrate, a second holder for the second substrate, and imaging devices that capture images of both substrates. The apparatus also features light irradiating devices that illuminate the substrates during imaging, enhancing the accuracy of the bonding process.

Career Highlights

Shinichi Shinozuka is currently employed at Tokyo Electron Limited, a leading company in the semiconductor and electronics industry. His work at the company has allowed him to develop and refine his innovative bonding technologies, contributing to the advancement of the industry.

Collaborations

Shinozuka has collaborated with notable coworkers, including Kunie Ogata and Masahide Tadokoro. Their combined expertise has fostered a productive environment for innovation and development in their respective fields.

Conclusion

Shinichi Shinozuka's contributions to bonding systems and inspection methods have significantly impacted the technology landscape. His innovative patents and collaborative efforts continue to drive advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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