The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Sep. 28, 2020
Tokyo Electron Limited, Tokyo, JP;
Yoshitaka Otsuka, Koshi, JP;
Shigeto Tsuruta, Koshi, JP;
Yuji Mimura, Koshi, JP;
Hiroshi Maeda, Koshi, JP;
Eiji Manabe, Koshi, JP;
Hisanori Hizume, Sapporo, JP;
Shinichi Shinozuka, Koshi, JP;
Hironori Tanoue, Koshi, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.