Sapporo, Japan

Hisanori Hizume

This inventor holds 2 USPTO granted patents. Top assignee: Tokyo Electron Limited. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisanori Hizume. Retrieved from https://idiyas.com/inventor/hisanori-hizume

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: Hisanori Hizume: Innovator in Bonding Systems

Introduction

Hisanori Hizume is a notable inventor based in Sapporo, Japan. He has made significant contributions to the field of bonding systems, holding a total of 2 patents. His work focuses on improving the methods and devices used in the inspection and measurement of combined substrates.

Latest Patents

Hisanori Hizume's latest patents include a bonding system and an inspection method for inspecting combined substrates. The bonding system comprises a bonding device, an inspection device, and a controller. The bonding device is responsible for forming a combined substrate by bonding a first substrate and a second substrate together. The inspection device plays a crucial role in inspecting the combined substrate, while the controller manages the inspection process. The controller features a measurement controller, a comparison unit, and a re-measurement controller. The measurement controller directs the inspection device to measure the combined substrate at a specified number of measurement points. The comparison unit then compares the inspection results, including any deviation between the two substrates, against a reference. If necessary, the re-measurement controller instructs the inspection device to re-measure the combined substrate at an increased number of measurement points based on the comparison results.

Another significant patent involves a measuring method and device. This method includes measuring a displacement and positioning an imaging unit to capture an image of a measurement mark. The imaging unit focuses on the measurement mark while adjusting the focal position based on the measured displacement. This innovative approach enhances the accuracy of position deviation measurements within the combined substrate.

Career Highlights

Hisanori Hizume is currently employed at Tokyo Electron Limited, a leading company in the semiconductor and electronics industry. His work at the company has allowed him to develop and refine his innovative ideas in bonding systems and measurement techniques.

Collaborations

Hisanori has collaborated with notable coworkers, including Shigeto Tsuruta and Yuji Mimura. Their combined expertise has contributed to the advancement of technologies in their field.

Conclusion

Hisanori Hizume is a distinguished inventor whose work in bonding systems and measurement methods has made a significant impact in the industry. His innovative patents reflect his commitment to enhancing technology in substrate bonding and inspection.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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