Company Filing History:
Years Active: 2025
Title: Hironori Tanoue: Innovator in Bonding Systems
Introduction
Hironori Tanoue is a notable inventor based in Koshi, Japan. He has made significant contributions to the field of bonding systems, particularly through his innovative patent. His work focuses on enhancing the efficiency and accuracy of substrate bonding and inspection processes.
Latest Patents
Hironori Tanoue holds a patent for a bonding system and inspection method designed to inspect combined substrates. This system includes a bonding device, an inspection device, and a controller. The bonding device is responsible for forming a combined substrate by bonding a first substrate and a second substrate together. The inspection device plays a crucial role in inspecting the combined substrate. The controller manages the inspection device and consists of a measurement controller, a comparison unit, and a re-measurement controller. The measurement controller directs the inspection device to measure the combined substrate at a specified number of measurement points. The comparison unit then compares the inspection results, which include a deviation amount between the first and second substrates, against a reference. Based on the comparison results, the re-measurement controller instructs the inspection device to re-measure the combined substrate at a greater number of measurement points.
Career Highlights
Hironori Tanoue is currently employed at Tokyo Electron Limited, a leading company in the semiconductor and electronics manufacturing industry. His work at the company has allowed him to apply his innovative ideas and contribute to advancements in bonding technology.
Collaborations
Hironori Tanoue collaborates with fellow inventor Yoshitaka Otsuka, working together to push the boundaries of technology in their field.
Conclusion
Hironori Tanoue's contributions to bonding systems and inspection methods highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the efficiency of substrate bonding processes.