Yokkaichi, Japan

Shingo Nakajima

USPTO Granted Patents = 9 

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Kanagawa-ken, JP (2012)
  • Yokkaichi Mie, JP (2020)
  • Yokkaichi, JP (2014 - 2022)

Company Filing History:


Years Active: 2012-2024

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9 patents (USPTO):Explore Patents

Title: Shingo Nakajima: Innovator in Semiconductor Technology

Introduction

Shingo Nakajima is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work has been instrumental in advancing the design and manufacturing methods of semiconductor devices.

Latest Patents

Among his latest patents, Nakajima has developed a semiconductor device and manufacturing method that includes a semiconductor substrate, a peripheral circuit, and a stacked body with a memory cell array. The peripheral circuit features a metal film made of silicon, a silicide film, and a barrier metal film. Another notable patent involves a semiconductor device that comprises a substrate, an interconnect layer, a layer stack, and a first silicon nitride layer. This device includes a transistor and a first interconnect, with conductive layers stacked and separated by insulation layers.

Career Highlights

Throughout his career, Nakajima has worked with notable companies such as Toshiba Memory Corporation and Kabushiki Kaisha Toshiba. His experience in these organizations has allowed him to refine his expertise in semiconductor technology and contribute to various innovative projects.

Collaborations

Shingo Nakajima has collaborated with talented individuals in the field, including Ryota Asada and Hidenobu Nagashima. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Shingo Nakajima's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor devices and manufacturing methods.

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