The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Mar. 21, 2012
Applicant:

Shingo Nakajima, Yokkaichi, JP;

Inventor:

Shingo Nakajima, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 45/00 (2006.01); H01L 27/105 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76895 (2013.01); H01L 21/76897 (2013.01); H01L 45/04 (2013.01); H01L 45/1233 (2013.01); H01L 27/105 (2013.01); H01L 45/16 (2013.01); H01L 45/1675 (2013.01); H01L 27/2463 (2013.01); H01L 27/2481 (2013.01);
Abstract

When a first wiring and/or a second wiring is formed, a connection portion is formed in the first wiring and/or the second wiring which covers a part of a lower electrode layer outside the memory cell array. An etching suppressing portion is formed above the connection portion. A contact hole is formed in which a portion under the etching suppressing portion reaches up to a connection potion, and the other portion reaches up to the lower electrode layer by performing etching to a laminated body in a range including the etching suppressing portion. The laminated body includes the insulating layer, the first wiring, a memory cell layer, the second wiring, and the etching suppressing portion. The contact layer is formed by burying a conductive material in the contact hole.


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