The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Dec. 06, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Takashi Izumi, Yokkaichi, JP;

Akitsugu Hatazaki, Yokkaichi, JP;

Shingo Nakajima, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 41/40 (2023.01); H01L 23/522 (2006.01); H10B 41/10 (2023.01); H10B 41/20 (2023.01); H10B 43/10 (2023.01); H10B 43/20 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H10B 41/40 (2023.02); H01L 23/5228 (2013.01); H10B 41/10 (2023.02); H10B 41/20 (2023.02); H10B 43/10 (2023.02); H10B 43/20 (2023.02); H10B 43/40 (2023.02);
Abstract

A semiconductor device according to one embodiment includes: a semiconductor substrate; a peripheral circuit provided on the semiconductor substrate; and a stacked body provided above the peripheral circuit, which has a memory cell array. The peripheral circuit includes: a metal film including silicon; a silicide film stacked on the metal film; and a barrier metal film stacked on the silicide film.


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