Company Filing History:
5 out of 985 
1 out of 618 
1 out of 16 
Years Active: 2019-2022
Title: Shijo Nagao: Innovator in Substrate Evaluation Technology
Introduction
Shijo Nagao is a prominent inventor based in Suita, Japan, known for his contributions to substrate evaluation technology. With a total of five patents to his name, he has made significant advancements in the field of thermal characteristics evaluation for mounting substrates used in power semiconductors.
Latest Patents
Among his latest patents are the substrate evaluation chip and substrate evaluation device. The substrate evaluation chip is designed to perform tests that evaluate the thermal characteristics of a mounting substrate that can accommodate a power semiconductor. This innovative chip features an insulating substrate bonded to the mounting substrate, along with a heating pattern formed on the surface of the insulating substrate by a metallic film. The heating pattern is optimized to distribute heat more uniformly across the insulating substrate. The insulating substrate itself is made from a single crystal substrate with a thermal conductivity of 250 [W/mK] or more, ensuring efficient thermal management. Additionally, he has developed a bonding material that includes an amorphous silver film, along with methods for producing this bonding material and the resulting bonding structure.
Career Highlights
Shijo Nagao has had a distinguished career, working at notable institutions such as Osaka University and National Cheng-kung University. His work has focused on enhancing the performance and reliability of semiconductor devices through innovative substrate evaluation techniques.
Collaborations
Throughout his career, Nagao has collaborated with esteemed colleagues, including Katsuaki Suganuma and Akio Shimoyama. These partnerships have contributed to the advancement of technology in the semiconductor field.
Conclusion
Shijo Nagao's innovative work in substrate evaluation technology has made a significant impact on the semiconductor industry. His patents reflect a commitment to improving thermal management and bonding techniques, showcasing his expertise and dedication to advancing technology.
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