The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Jun. 16, 2017
Osaka University, Osaka, JP;
Katsuaki Suganuma, Suita, JP;
Shijo Nagao, Suita, JP;
Akio Shimoyama, Suita, JP;
Shinya Seki, Suita, JP;
OSAKA UNIVERSITY, Osaka, JP;
Abstract
A bonding device () bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device () includes a wall section (), at least one pressing section (), and a rotational shaft (). The rotational shaft () is fixed to the wall section (). Each pressing section () has an arm () and a presser () or a substrate supporting member (). The arm () extends from the rotational shaft (). The arm () pivots about the rotational shaft (). The presser () presses the component (C). The substrate supporting member () is disposed on a reference surface (). The substrate supporting member () supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser () with the component (C) or point contact of the substrate supporting member () with the reference surface ().