The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Aug. 20, 2020
Osaka University, Suita, JP;
Yamato Scientific Co., Ltd., Tokyo, JP;
Katsuaki Suganuma, Suita, JP;
Shijo Nagao, Suita, JP;
Akio Shimoyama, Suita, JP;
Dongjin Kim, Suita, JP;
Kazutaka Takeshita, Tokyo, JP;
Naoki Wakasugi, Tokyo, JP;
OSAKA UNIVERSITY, Suita, JP;
YAMATO SCIENTIFIC CO., LTD., Tokyo, JP;
Abstract
A substrate evaluation chip is used to perform a test for evaluating a thermal characteristic of a mounting substrate that is mountable a power semiconductor. The substrate evaluation chip includes an insulating substrate bonded with the mounting substrate, and a heating pattern that is formed on a surface of the insulating substrate by a metallic film and is arranged by having a predetermined shape that is optimized to beat the insulating substrate more uniformly. The insulating substrate is a substrate in which an insulating film is formed on a surface of a single crystal substrate having a thermal conductivity of 250 [W/mK] or more.