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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shih-Jane Lin

USPTO Granted Patents = 12

Average Co-Inventor Count = 7.1

ph-index = 7

Forward Citations = 197(Granted Patents)


Company Filing History:

goldMedal12 out of 40,927 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2002-2010

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12 patents (USPTO):Explore Patents
1. 7816169 - Colors only process to reduce package yield loss (2010-10-19),
2. 7485906 - Colors only process to reduce package yield loss (2009-02-03),
3. 7183598 - Colors only process to reduce package yield loss (2007-02-27),
4. 6956292 - Bumping process to increase bump height and to create a more robust bump structure (2005-10-18),
5. 6876049 - Colors only process to reduce package yield loss (2005-04-05),
6. 6649507 - Dual layer photoresist method for fabricating a mushroom bumping plating structure (2003-11-18),
7. 6632700 - Method to form a color image sensor cell while protecting the bonding pad structure from damage (2003-10-14),
8. 6605524 - Bumping process to increase bump height and to create a more robust bump structure (2003-08-12),
9. 6583039 - Method of forming a bump on a copper pad (2003-06-24),
10. 6482669 - Colors only process to reduce package yield loss (2002-11-19),
11. 6426283 - Method for bumping and backlapping a semiconductor wafer (2002-07-30),
12. 6372545 - Method for under bump metal patterning of bumping process (2002-04-16),

Title: Shih-Jane Lin: Innovator in Microelectronic Fabrication

Introduction

Shih-Jane Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the development of innovative fabrication processes. With a total of 12 patents to his name, Lin's work has had a substantial impact on imaging technology.

Latest Patents

One of Lin's latest patents is titled "Colors only process to reduce package yield loss." This invention discloses an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device. The process creates a concave-up pixel surface, which is then overlayed with a high transmittance planarizing film. This film is designed with specific indices of refraction and physical properties that optimize light collection to the photodiode without the need for additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage. It minimizes topographical underlayer variations that could aberrate or cause reflection losses of images formed on non-planar surfaces. Additionally, it obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate, which is then provided with metal photoshields and passivated before the color filters are formed.

Career Highlights

Shih-Jane Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in the field of microelectronics. His work has been instrumental in advancing imaging technologies and improving manufacturing processes.

Collaborations

Lin has collaborated with notable colleagues, including Yang-Tung Fan and Chiou-Shian Peng, who is a talented woman in the field. Their combined expertise has contributed to the success of various projects and innovations.

Conclusion

Shih-Jane Lin's contributions to microelectronic fabrication and imaging technology are noteworthy. His innovative patents and collaborations highlight his role as a leading inventor in the industry.

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