The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2002
Filed:
Dec. 01, 2000
Yen-Ming Chen, Hsin Chu, TW;
Kuo-Wei Lin, Hsinchu, TW;
Cheng-Yu Chu, Hsinchu, TW;
Fu-Jier Fan, Jubei, TW;
Yang-Tung Fan, Jubei, TW;
Chiou-Shian Peng, Hsin-Chu, TW;
Shih-Jane Lin, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Abstract
A method for bumping and backlapping a semiconductor wafer that has a multiplicity of solder bumps formed on an active surface of the wafer is disclosed. In the method, a preprocessed wafer that has a multiplicity of bond pads formed on a top surface is first provided, a under-bump-metallurgy (UBM) layer is then sputter deposited on top of the wafer surface, followed by the lamination of a dry film resist layer on top of the UBM layer. The dry film resist layer is then patterned with a multiplicity of openings exposing the multiplicity of bond pads, followed by the deposition of a solder material into the multiplicity of openings to form the solder bump's. A protective tape is then adhesively bonded to the top of the dry film resist layer before the wafer is positioned into a backlapping apparatus for removing of a preselected thickness from the backside of the wafer. After the completion of the backside lapping process, the protective tape and the dry film resist layer are stripped away sequentially and the solder bumps are reflown into solder balls. The present invention novel method effectively prevents any damages to. the solder balls during the backlapping process since the solder bumps are well protected by the dry film resist layer during such process.