Gyeonggi, South Korea

SeungWon Kim

This inventor holds 4 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2013-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: SeungWon Kim. Retrieved from https://idiyas.com/inventor/seungwon-kim-eg42618o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2013-2015

Loading Chart...
4 patents (USPTO):Explore Patents

Title: SeungWon Kim: Innovator in Semiconductor Technology

Introduction

SeungWon Kim is a prominent inventor based in Kyunggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor device and method of forming a shielding layer grounded through metal pillars formed in the peripheral region of the semiconductor. This innovative shielded semiconductor device involves mounting a semiconductor die to a first substrate, forming an encapsulant over the die, and creating a dicing channel through the encapsulant. A shielding layer is then formed over the encapsulant and semiconductor die, with a metal pillar providing an electrical connection to a ground plane in a second substrate. This design ensures a mechanically secure connection and enhances the device's overall performance.

Another notable patent by SeungWon Kim is the semiconductor device and method of forming a uniform height insulating layer over an interposer frame as a standoff for the semiconductor die. This invention features an interposer frame with a die attach area, where a uniform height insulating layer is formed. The insulating layer can be shaped as rectangular or circular pillars, providing a consistent standoff distance between the semiconductor die and the interposer frame. This design improves the bonding process and overall reliability of the semiconductor device.

Career Highlights

SeungWon Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout his career, SeungWon Kim has collaborated with talented individuals such as DaeWook Yang and MinJung Kim. These collaborations have contributed to the successful development of his innovative patents.

Conclusion

SeungWon Kim is a key figure in the semiconductor industry, with a focus on developing advanced technologies that enhance device performance. His contributions through his patents reflect his commitment to innovation and excellence in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…