Seungman Choi

Title: Seungman Choi: Innovator in Photonic Integrated Circuits

Introduction

Seungman Choi is a notable inventor based in Loudonville, NY (US). He has made significant contributions to the field of photonic integrated circuits and integrated circuit chip structures. With a total of 3 patents, his work has advanced the technology used in optical devices and semiconductor packaging.

Latest Patents

One of his latest patents is titled "PIC structure with wire(s) between z-stop supports on side of optical device attach cavity." This innovation involves a photonic integrated circuit (PIC) structure that includes a substrate and a cavity defined in the substrate. The cavity features a shoulder at its side, along with multiple z-stop supports for an optical device. A wire extends over the cavity's side and connects at least two z-stop supports, allowing for improved electrical connections to mitigate electromigration issues.

Another significant patent is "Interconnected integrated circuit (IC) chip structure and packaging and method of forming same." This patent describes an IC chip structure that includes several IC chips electrically connected in the back-end-of-line (BEOL) interconnect layer. The structure features openings in crack-stop structures surrounding the IC chips, with interconnect wires extending through these openings. This innovation also includes a packaging structure that accommodates inoperable IC chips.

Career Highlights

Seungman Choi has worked with prominent companies in the semiconductor industry, including GlobalFoundries Inc. and GlobalFoundries U.S. Inc. His experience in these organizations has allowed him to contribute to cutting-edge technologies in integrated circuits and photonics.

Collaborations

Throughout his career, Choi has collaborated with esteemed colleagues such as Wolfgang Sauter and Mark William Kuemerle. These partnerships have fostered innovation and development in their respective fields.

Conclusion

Seungman Choi's contributions to photonic integrated circuits and integrated circuit structures demonstrate his commitment to advancing technology. His patents reflect a deep understanding of the challenges in the field and offer innovative solutions that enhance the performance of optical devices and semiconductor packaging.