This inventor holds 10 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University, University of Illinois. Active years: 2014-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Gangnam-gu, KR (2019)
- Champaign, IL (US) (2020)
- Suwon-si, KR (2021)
- Seoul, KR (2014 - 2024)
Company Filing History:
7 out of 138,671 
2 out of 1,377 
2 out of 2,437 
Years Active: 2014-2026
Title: Seunghyun Baik: Innovator in Semiconductor Packaging
Introduction
Seunghyun Baik is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 10 patents that enhance the reliability and yield of integrated circuit devices. His work is instrumental in advancing technology in the semiconductor industry.
Latest Patents
Baik's latest patents focus on innovative semiconductor package designs. One of his notable inventions is a packaged integrated circuit device that features enhanced dam structures. This design includes a substrate with a first semiconductor chip and electrically conductive bumps that connect the chip to the substrate. A non-conductive film layer is integrated, extending between the conductive bumps. Additionally, a second semiconductor chip is placed on the substrate, with electrically conductive wires connecting it to the substrate. The design also incorporates a dam that protrudes in specific regions, improving the overall functionality and reliability of the semiconductor package.
Another significant patent involves a semiconductor package that includes a package substrate with a main pad and wiring pattern. This design features a semiconductor chip mounted on the substrate, with connection bumps and a dummy insulating pattern that covers the main wiring. The inclusion of dummy pillars enhances the structural integrity of the package while ensuring electrical insulation.
Career Highlights
Seunghyun Baik is currently employed at Samsung Electronics Ltd., a leading company in the technology sector. His role at Samsung allows him to leverage his expertise in semiconductor technology, contributing to the development of cutting-edge electronic devices.
Conclusion
Seunghyun Baik's innovative work in semiconductor packaging exemplifies the importance of advancements in technology. His patents not only enhance the reliability of integrated circuits but also pave the way for future innovations in the semiconductor industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile