The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
May. 18, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seunghyun Baik, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a first semiconductor chip disposed on the substrate, the first semiconductor chip having a stepped portion, a second semiconductor chip disposed on the substrate and horizontally spaced apart from the first semiconductor chip in the first direction, a third semiconductor chip disposed on the second semiconductor chip and a bottom surface of the stepped portion, and an upper adhesive layer disposed between the second semiconductor chip and the third semiconductor chip, the upper adhesive layer contacting a portion of the bottom surface of the stepped portion.