Samsung Electronics Co., Ltd.

University of Illinois

Sungkyunkwan University

Lsis Co., Ltd.

Seunghyun Baik

Michael S Strano

Paul Walter Barone

Dongmok Lee

Sanghoon Lee

Wookdong Cho

Jeonghyun Sim

Chuldong Moon

Daewoo Suh

Hyeonjeong Choi

Wonyoung Kim

A semiconductor package includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a first semiconductor chip disposed on the substrate, the first semiconductor chip having a stepped portion, a second semiconductor chip disposed on the substrate and horizontally spaced apart from the first semiconductor chip in the first direction, a third semiconductor chip disposed on the second semiconductor chip and a bottom surface of the stepped portion, and an upper adhesive layer disposed between the second semiconductor chip and the third semiconductor chip, the upper adhesive layer contacting a portion of the bottom surface of the stepped portion.

Semiconductor package comprising semiconductor chip with stepped portion

A semiconductor package according to the exemplary embodiments of the disclosure includes a base substrate including a base bonding pad, a first semiconductor chip disposed on the base substrate, a first adhesive layer provided under the first semiconductor chip, a first bonding pad provided in a bonding region on an upper surface of the first semiconductor chip, a first bonding wire interconnecting the base bonding pad and the first bonding pad, and a crack preventer provided in a first region at the upper surface of the first semiconductor chip. The crack preventer includes dummy pads provided at opposite sides of the first region and a dummy wire interconnecting the dummy pads.

Semiconductor package including a dummy pad

A semiconductor package includes a package substrate including an insulating layer having an upper surface and a lower surface and provided with a first region which is recessed to a first depth from the upper surface toward the lower surface, a redistribution wiring buried in the insulating layer, a chip connection pad on a bottom surface of the recessed first region and connected to the redistribution wiring, and a wire connection pad on the upper surface of the insulating layer and connected to the redistribution wiring, a first semiconductor chip overlapping, in a top-down view of the semiconductor package, the recessed first region of the insulating layer and comprising a first chip pad connected to the chip connection pad of the package substrate, and a second semiconductor chip on the first semiconductor chip and connected to the wire connection pad of the package substrate through a conductive wire.

Semiconductor package

A semiconductor package includes a substrate, a first chip on the substrate, a second chip on the substrate and arranged side-by-side with the first chip, and a support structure on the second chip. A width of the support structure is equal to or greater than a width of the second chip.

Sensing compositions, sensing element, sensing systems and sensing devices for the detection and/or quantitation of one or more analytes. Compositions comprising carbon nanotubes in which the carbon nanotubes retain their ability to luminesce and in which that luminescence is rendered selectively sensitive to the presence of an analyte. Compositions comprising individually dispersed carbon nanotubes, which are electronically isolated from other carbon nanotubes, yet which are associated with chemical selective species, such as polymers, particularly biological polymers, for example proteins, which can interact selectively with, or more specifically selectivity bind to, an analyte of interest. Chemically selective species bind, preferably non-covalently, to the carbon nanotube and function to provide for analyte selectivity. Chemically selective species include polymers to which one or more chemically selective groups are covalently attached. Chemically selective polymers include, for example, proteins and polysaccharides.

Sensors employing single-walled carbon nanotubes

In some embodiments, the effect of uniformly dispersing carbon nanotubes in the material is achieved by including Ag in the carbon nanotubes to suppress the aggregation of carbon nanotubes when the electrical contacts are prepared.

Method for electrical contact materials including Ag plated CNTs

A thermoelectric material includes a stretchable polymer, and a thermoelectric structure and an electrically conductive material that are mixed together with the stretchable polymer. The thermoelectric material may be applied to self-power generating wearable electronic apparatuses.

Stretchable thermoelectric material and thermoelectric device including the same

Sensing compositions, sensing element, sensing systems and sensing devices for the detection and/or quantitation of one or more analytes, Compositions comprising carbon nanotubes in which the carbon nanotubes retain their ability to luminesce and in which that luminescence is rendered selectively sensitive to the presence of an analyte. Compositions comprising individually dispersed carbon nanotubes, which are electronically isolated from other carbon nanotubes, yet which are associated with chemical selective species, such as polymers, particularly biological polymers, for example proteins, which can interact selectively with, or more specifically selectivity bind to, an analyte of interest. Chemically selective species bind, preferably non-covalently, to the carbon nanotube and function to provide for analyte selectivity. Chemically selective species include polymers to which one or more chemically selective groups are covalently attached. Chemically selective polymers include, for example, proteins and polysaccharides.

Growing community of inventors

Seoul, South Korea

Seunghyun Baik